Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance

10.1109/SENSORS47125.2020.9278879

Saved in:

Bibliographic Details
Main Authors:	JIEMING PAN, Li Yida, LUO YUXUAN, ZHANG XIANGYU, Zaifeng Yang, Wong Liang Tai,David, Niu Xuhua, Tham Chen Khong, THEAN VOON YEW, AARON
Other Authors:	COLLEGE OF DESIGN AND ENGINEERING
Format:	Conference or Workshop Item
Published:	IEEE sensors 2022
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/218156
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

Be the first to leave a comment!

Similar Items