Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance

10.1109/SENSORS47125.2020.9278879

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Bibliographic Details
Main Authors:	JIEMING PAN, Li Yida, LUO YUXUAN, ZHANG XIANGYU, Zaifeng Yang, Wong Liang Tai,David, Niu Xuhua, Tham Chen Khong, THEAN VOON YEW, AARON
Other Authors:	COLLEGE OF DESIGN AND ENGINEERING
Format:	Conference or Workshop Item
Published:	IEEE sensors 2022
Online Access:	https://scholarbank.nus.edu.sg/handle/10635/218156
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-218156
record_format	dspace
spelling	sg-nus-scholar.10635-2181562024-11-14T13:00:06Z Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance JIEMING PAN Li Yida LUO YUXUAN ZHANG XIANGYU Zaifeng Yang Wong Liang Tai,David Niu Xuhua Tham Chen Khong THEAN VOON YEW, AARON COLLEGE OF DESIGN AND ENGINEERING 10.1109/SENSORS47125.2020.9278879 IEEE SENSORS 2022-03-31T07:44:03Z 2022-03-31T07:44:03Z 2020-10-25 Conference Paper JIEMING PAN, Li Yida, LUO YUXUAN, ZHANG XIANGYU, Zaifeng Yang, Wong Liang Tai,David, Niu Xuhua, Tham Chen Khong, THEAN VOON YEW, AARON (2020-10-25). Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance. IEEE SENSORS. ScholarBank@NUS Repository. https://doi.org/10.1109/SENSORS47125.2020.9278879 2168-9229 https://scholarbank.nus.edu.sg/handle/10635/218156 Attribution-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nd/4.0/ IEEE sensors
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1109/SENSORS47125.2020.9278879
author2	COLLEGE OF DESIGN AND ENGINEERING
author_facet	COLLEGE OF DESIGN AND ENGINEERING JIEMING PAN Li Yida LUO YUXUAN ZHANG XIANGYU Zaifeng Yang Wong Liang Tai,David Niu Xuhua Tham Chen Khong THEAN VOON YEW, AARON
format	Conference or Workshop Item
author	JIEMING PAN Li Yida LUO YUXUAN ZHANG XIANGYU Zaifeng Yang Wong Liang Tai,David Niu Xuhua Tham Chen Khong THEAN VOON YEW, AARON
spellingShingle	JIEMING PAN Li Yida LUO YUXUAN ZHANG XIANGYU Zaifeng Yang Wong Liang Tai,David Niu Xuhua Tham Chen Khong THEAN VOON YEW, AARON Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance
author_sort	JIEMING PAN
title	Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance
title_short	Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance
title_full	Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance
title_fullStr	Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance
title_full_unstemmed	Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance
title_sort	seal integrity testing utilizing non-destructive capacitive sensing for product packaging assurance
publisher	IEEE sensors
publishDate	2022
url	https://scholarbank.nus.edu.sg/handle/10635/218156
_version_	1821208282986971136

Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance

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