Integration of CNTs in 3D-IC interconnects: a non-destructive approach for the precise characterization and elucidation of interfacial properties

• Main Authors: Ghosh, K., Verma, Y. K., Tan, Chuan Seng
• 其他作者: School of Electrical and Electronic Engineering
• 格式: Article
• 語言: English
• 出版: 2016
• 主題: Electrical and Electronic Engineering
• 在線閱讀: https://hdl.handle.net/10356/81430; http://hdl.handle.net/10220/40792
• 機構: Nanyang Technological University

Having an array of novel functionalities and performance advantages, Multi-Walled Carbon Nanotubes (MWCNT) are one of the most promising nanomaterials to replace metals like copper and aluminum in the low-dimensional interconnects in three-dimensional (3D) integrated circuits (3D-IC) and sensors. Lo...