Industrial attachment with Advanced Micro Devices
The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated.
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2008
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| Online Access: | http://hdl.handle.net/10356/8165 |
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| Institution: | Nanyang Technological University |
| Summary: | The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated. |
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