Industrial attachment with Advanced Micro Devices

The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated.

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Bibliographic Details
Main Author: Chua, Pauline May Lee.
Other Authors: Widjaja, Sujanto
Format: Industrial Attachment (IA)
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/8165
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Institution: Nanyang Technological University
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