Industrial attachment with Advanced Micro Devices
The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated.
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sg-ntu-dr.10356-81652020-09-27T20:13:33Z Industrial attachment with Advanced Micro Devices Chua, Pauline May Lee. Widjaja, Sujanto School of Applied Science DRNTU::Engineering::Computer science and engineering The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated. 2008-09-23T09:20:25Z 2008-09-23T09:20:25Z 2004 2004 Industrial Attachment (IA) http://hdl.handle.net/10356/8165 Nanyang Technological University application/pdf |
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DRNTU::Engineering::Computer science and engineering Chua, Pauline May Lee. Industrial attachment with Advanced Micro Devices |
description |
The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated. |
author2 |
Widjaja, Sujanto |
author_facet |
Widjaja, Sujanto Chua, Pauline May Lee. |
format |
Industrial Attachment (IA) |
author |
Chua, Pauline May Lee. |
author_sort |
Chua, Pauline May Lee. |
title |
Industrial attachment with Advanced Micro Devices |
title_short |
Industrial attachment with Advanced Micro Devices |
title_full |
Industrial attachment with Advanced Micro Devices |
title_fullStr |
Industrial attachment with Advanced Micro Devices |
title_full_unstemmed |
Industrial attachment with Advanced Micro Devices |
title_sort |
industrial attachment with advanced micro devices |
publishDate |
2008 |
url |
http://hdl.handle.net/10356/8165 |
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1681057072218636288 |