Industrial attachment with Advanced Micro Devices
The project undertaken involved development of the encapsulation materials and process for the uBGA package. Two types of uBGA packages were evaluated.
Saved in:
Main Author: | Chua, Pauline May Lee. |
---|---|
Other Authors: | Widjaja, Sujanto |
Format: | Industrial Attachment (IA) |
Published: |
2008
|
Subjects: | |
Online Access: | http://hdl.handle.net/10356/8165 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Similar Items
-
Report on industrial attachment with Advanced Micro Devices (S) Pte Ltd
by: Chew, Edwin Jia Wei.
Published: (2008) -
Report on industrial attachment
by: Satish Chandra Gandikota.
Published: (2008) -
Industrial attachment report
by: Chen, Lucan.
Published: (2012) -
Report on industrial attachment with Tyco international
by: Lee, Vincent Yong Harn.
Published: (2008) -
Report on industrial attachment with Omniway Solutions
by: Jin, Dong
Published: (2008)