A New Model for Temperature Jump at a Fluid-Solid Interface
The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified...
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sg-ntu-dr.10356-847362023-03-04T17:15:49Z A New Model for Temperature Jump at a Fluid-Solid Interface Shu, Jian-Jun Teo, Ji Bin Melvin Chan, Weng Kong School of Mechanical and Aerospace Engineering Temperature jump Colloid The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified model for the fluid-solid temperature jump has been developed based on our adsorption model of the interfacial interactions. Results obtained from this model are validated with available results from the literature. Published version 2016-12-23T02:40:35Z 2019-12-06T15:50:32Z 2016-12-23T02:40:35Z 2019-12-06T15:50:32Z 2016 2016 Journal Article Shu, J.-J., Teo, J. B. M., & Chan, W. K. (2016). A New Model for Temperature Jump at a Fluid-Solid Interface. PLoS ONE, 11(10), e0165175-. https://hdl.handle.net/10356/84736 http://hdl.handle.net/10220/41939 10.1371/journal.pone.0165175 27764230 195374 en PLoS ONE © 2016 Shu et al. This is an open access article distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited. 12 p. application/pdf |
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Singapore Singapore |
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| language |
English |
| topic |
Temperature jump Colloid |
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Temperature jump Colloid Shu, Jian-Jun Teo, Ji Bin Melvin Chan, Weng Kong A New Model for Temperature Jump at a Fluid-Solid Interface |
| description |
The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified model for the fluid-solid temperature jump has been developed based on our adsorption model of the interfacial interactions. Results obtained from this model are validated with available results from the literature. |
| author2 |
School of Mechanical and Aerospace Engineering |
| author_facet |
School of Mechanical and Aerospace Engineering Shu, Jian-Jun Teo, Ji Bin Melvin Chan, Weng Kong |
| format |
Article |
| author |
Shu, Jian-Jun Teo, Ji Bin Melvin Chan, Weng Kong |
| author_sort |
Shu, Jian-Jun |
| title |
A New Model for Temperature Jump at a Fluid-Solid Interface |
| title_short |
A New Model for Temperature Jump at a Fluid-Solid Interface |
| title_full |
A New Model for Temperature Jump at a Fluid-Solid Interface |
| title_fullStr |
A New Model for Temperature Jump at a Fluid-Solid Interface |
| title_full_unstemmed |
A New Model for Temperature Jump at a Fluid-Solid Interface |
| title_sort |
new model for temperature jump at a fluid-solid interface |
| publishDate |
2016 |
| url |
https://hdl.handle.net/10356/84736 http://hdl.handle.net/10220/41939 |
| _version_ |
1759856609081688064 |