A New Model for Temperature Jump at a Fluid-Solid Interface

The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified...

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Main Authors: Shu, Jian-Jun, Teo, Ji Bin Melvin, Chan, Weng Kong
其他作者: School of Mechanical and Aerospace Engineering
格式: Article
語言:English
出版: 2016
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在線閱讀:https://hdl.handle.net/10356/84736
http://hdl.handle.net/10220/41939
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機構: Nanyang Technological University
語言: English

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