A New Model for Temperature Jump at a Fluid-Solid Interface

The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified...

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Bibliographic Details
Main Authors: Shu, Jian-Jun, Teo, Ji Bin Melvin, Chan, Weng Kong
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2016
Subjects:
Online Access:https://hdl.handle.net/10356/84736
http://hdl.handle.net/10220/41939
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Institution: Nanyang Technological University
Language: English

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