A New Model for Temperature Jump at a Fluid-Solid Interface

• Main Authors: Shu, Jian-Jun, Teo, Ji Bin Melvin, Chan, Weng Kong
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2016
• Subjects: Temperature jump; Colloid
• Online Access: https://hdl.handle.net/10356/84736; http://hdl.handle.net/10220/41939
• Institution: Nanyang Technological University

The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified...