A New Model for Temperature Jump at a Fluid-Solid Interface

• المؤلفون الرئيسيون: Shu, Jian-Jun, Teo, Ji Bin Melvin, Chan, Weng Kong
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2016
• الموضوعات: Temperature jump; Colloid
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/84736; http://hdl.handle.net/10220/41939
• المؤسسة: Nanyang Technological University

The problem presented involves the development of a new analytical model for the general fluid-solid temperature jump. To the best of our knowledge, there are no analytical models that provide the accurate predictions of the temperature jump for both gas and liquid systems. In this paper, a unified...