Understanding the bonding mechanisms of directly sputtered copper thin film on an alumina substrate
The evaluation of bonding mechanisms between magnetron sputtered copper (Cu) thin films and a ceramic substrate was carried out using polycrystalline and monocrystalline alumina (Al2O3) substrates with different surface roughness. Three different bonding mechanisms, viz., surface adsorption, mechani...
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| Main Authors: | , , |
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| 格式: | Article |
| 語言: | English |
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2017
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| 在線閱讀: | https://hdl.handle.net/10356/86256 http://hdl.handle.net/10220/43998 |
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