Thermal failure of carbon nanostructures

• 主要作者: Maurice, Ange
• 其他作者: Tay Beng Kang
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2019
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• 在線閱讀: https://hdl.handle.net/10356/89749; http://hdl.handle.net/10220/48047

The greatest weakness of integrated circuits is thermal. Localized temperature increase can significantly degrade circuit performances, sometimes irreversibly. To tackle this issue, carbon-based materials are envisioned as potential candidates to replace metals like copper, tungsten and aluminium. H...