Thermal failure of carbon nanostructures

• Main Author: Maurice, Ange
• Other Authors: Tay Beng Kang
• Format: Theses and Dissertations
• Language: English
• Published: 2019
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• Online Access: https://hdl.handle.net/10356/89749; http://hdl.handle.net/10220/48047
• Institution: Nanyang Technological University

The greatest weakness of integrated circuits is thermal. Localized temperature increase can significantly degrade circuit performances, sometimes irreversibly. To tackle this issue, carbon-based materials are envisioned as potential candidates to replace metals like copper, tungsten and aluminium. H...