Thermal failure of carbon nanostructures

• المؤلف الرئيسي: Maurice, Ange
• مؤلفون آخرون: Tay Beng Kang
• التنسيق: Theses and Dissertations
• اللغة: English
• منشور في: 2019
• الموضوعات: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/89749; http://hdl.handle.net/10220/48047

The greatest weakness of integrated circuits is thermal. Localized temperature increase can significantly degrade circuit performances, sometimes irreversibly. To tackle this issue, carbon-based materials are envisioned as potential candidates to replace metals like copper, tungsten and aluminium. H...