A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers
This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benef...
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2009
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/91621 http://hdl.handle.net/10220/5993 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured performance of the in-package filter is presented. The effects of the different physical parts of the package on the filter performance are investigated. Experimental results show that the in-package filter of size 15 X 15 X 1.905 mm3 achieved 3-dB percentage bandwidth of 14% and insertion loss of 2.07 dB at 5.25 GHz. |
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