A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers
This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benef...
Saved in:
Main Authors: | Phang, T. Y., Zhang, Yue Ping, Li, Xue Jun |
---|---|
Other Authors: | School of Electrical and Electronic Engineering |
Format: | Article |
Language: | English |
Published: |
2009
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/91621 http://hdl.handle.net/10220/5993 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
Novel antenna-in-package design in LTCC for single-chip RF transceivers
by: Lin, W., et al.
Published: (2010) -
Process development for flip chip BGA packages
by: Camenforte, Raymundo M.
Published: (2008) -
Antenna-in-Package and transmit–receive switch for single-chip radio transceivers of differential architecture
by: Zhang, Yue Ping, et al.
Published: (2010) -
Dual-mode dual-band bandpass filter using a single slotted circular patch resonator
by: Zhang, Runqi, et al.
Published: (2013) -
Performance of inter-chip RF-interconnect using CPW, capacitive coupler and UWB transceiver
by: Sun, Mei, et al.
Published: (2009)