A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers

• Main Authors: Phang, T. Y., Zhang, Yue Ping, Li, Xue Jun
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/91621; http://hdl.handle.net/10220/5993
• Institution: Nanyang Technological University

This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benefit to the system-level board miniaturization and the system-level manufacturing facilitation. The simulated and measured performance of the in-package filter is presented. The effects of the different physical parts of the package on the filter performance are investigated. Experimental results show that the in-package filter of size 15 X 15 X 1.905 mm3 achieved 3-dB percentage bandwidth of 14% and insertion loss of 2.07 dB at 5.25 GHz.