A study of dual-mode bandpass filter integrated in BGA package for single-chip RF transceivers

This paper presents a study of a dual-mode bandpass filter integrated in a ball grid array (BGA) package for the single-chip solutions of radio frequency (RF) transceivers. The novel in-package filter, except for the economical advantage of mass production and automatic assembly, has potential benef...

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Bibliographic Details
Main Authors: Phang, T. Y., Zhang, Yue Ping, Li, Xue Jun
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2009
Subjects:
Online Access:https://hdl.handle.net/10356/91621
http://hdl.handle.net/10220/5993
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Institution: Nanyang Technological University
Language: English
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