Temperature and stress distribution in the SOI structure during fabrication

Silicon wafer bonding technology is becoming one of the key technologies in the silicon-on-insulator (SOI) structure fabrication. However, the high-temperature heat treatment during SOI fabrication is inevitable, and the thermal stress thus induced could have an adverse effect on the device fabricat...

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Bibliographic Details
Main Authors: Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2009
Subjects:
Online Access:https://hdl.handle.net/10356/91726
http://hdl.handle.net/10220/4654
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Institution: Nanyang Technological University
Language: English
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