New salicidation technology with Ni(Pt) alloy for MOSFETs

A novel salicide technology to improve the thermal stability of the conventional Ni silicide has been developed by employing Ni(Pt) alloy salicidation. This technique provides an effective avenue to overcome the low thermal budget (<700 °C) of the conventional Ni salicidation by formi...

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Main Authors: Mangelinck, D., Chan, L., Lee, Pooi See, Pey, Kin Leong, Ding, Jun, Chi, Dong Zhi
其他作者: School of Materials Science & Engineering
格式: Article
語言:English
出版: 2012
主題:
在線閱讀:https://hdl.handle.net/10356/91823
http://hdl.handle.net/10220/8340
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機構: Nanyang Technological University
語言: English