Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power

The existing 3-D thermal-via allocation methods are based on the steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and efficient thermal-via allocation considering the temporally and spatially variant thermal-power. The transient temperat...

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Bibliographic Details
Main Authors: Yu, Hao, Shi, Yiyu, He, Lei, Karnik, Tanay
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2010
Subjects:
Online Access:https://hdl.handle.net/10356/92285
http://hdl.handle.net/10220/6262
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Institution: Nanyang Technological University
Language: English
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