Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power

• المؤلفون الرئيسيون: Yu, Hao, Shi, Yiyu, He, Lei, Karnik, Tanay
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2010
• الموضوعات: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/92285; http://hdl.handle.net/10220/6262

The existing 3-D thermal-via allocation methods are based on the steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and efficient thermal-via allocation considering the temporally and spatially variant thermal-power. The transient temperat...