Effect of plating parameters on the intrinsic stress in electroless nickel plating
With the increasing application of electroless nickel (EN) as a bumping or under-bumping metalization material, the microelectronic packaging engineers are required to have a deeper understanding and control of intrinsic stress in EN plating. The purpose of this work is to investigate the effect of...
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| Main Authors: | , , , |
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| 格式: | Article |
| 語言: | English |
| 出版: |
2012
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/94041 http://hdl.handle.net/10220/8175 |
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| 機構: | Nanyang Technological University |
| 語言: | English |