Effect of plating parameters on the intrinsic stress in electroless nickel plating

• Main Authors: Chen, Zhong, Xu, Xiaoda, Wong, Chee C., Mhaisalkar, Subodh Gautam
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/94041; http://hdl.handle.net/10220/8175
• Institution: Nanyang Technological University

With the increasing application of electroless nickel (EN) as a bumping or under-bumping metalization material, the microelectronic packaging engineers are required to have a deeper understanding and control of intrinsic stress in EN plating. The purpose of this work is to investigate the effect of...