Effect of plating parameters on the intrinsic stress in electroless nickel plating

• المؤلفون الرئيسيون: Chen, Zhong, Xu, Xiaoda, Wong, Chee C., Mhaisalkar, Subodh Gautam
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/94041; http://hdl.handle.net/10220/8175

With the increasing application of electroless nickel (EN) as a bumping or under-bumping metalization material, the microelectronic packaging engineers are required to have a deeper understanding and control of intrinsic stress in EN plating. The purpose of this work is to investigate the effect of...