Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films

Intermetallic compounds (IMCs) are present in microelectronic solder interconnects as a result of interfacial reaction between the solder and the metallization materials. Their mechanical properties are of great interest for the prediction of joint reliability of electronic packages. In this work, t...

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Main Authors: Chen, Zhong, He, Min, Balakrisnan, Bavani, Chum, Chan Choy
Other Authors: School of Materials Science & Engineering
Format: Article
Language:English
Published: 2012
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Online Access:https://hdl.handle.net/10356/94807
http://hdl.handle.net/10220/8147
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-948072023-07-14T15:53:18Z Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films Chen, Zhong He, Min Balakrisnan, Bavani Chum, Chan Choy School of Materials Science & Engineering DRNTU::Engineering::Materials Intermetallic compounds (IMCs) are present in microelectronic solder interconnects as a result of interfacial reaction between the solder and the metallization materials. Their mechanical properties are of great interest for the prediction of joint reliability of electronic packages. In this work, thin film Ni3Sn4 IMCs were formed by co-sputtering of Sn and Ni, followed by annealing at different temperatures. Elasticity modulus and hardness of the films were investigated by nano-indentation. It was found that measured hardness decreased with increasing residual tensile stress in the film. The elasticity modulus of the Ni3Sn4 thin films was measured to be around 134 GPa by nano-indentation. The fracture toughness of these Ni3Sn4 thin films varied considerably with the annealing temperature. It ranged from 2.11 ± 0.15 MPa m1/2 for 100 °C annealing to 5.75 ± 0.25 MPa m1/2 for 200 °C annealing. Densification during annealing is believed to be the cause of the increase in toughness. Accepted version 2012-05-28T03:41:43Z 2019-12-06T19:02:39Z 2012-05-28T03:41:43Z 2019-12-06T19:02:39Z 2006 2006 Journal Article Chen, Z., He, M., Balakrisnan, B., & Chum, C. C. (2006). Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films. Materials Science and Engineering A, 423(1-2), 107-110. https://hdl.handle.net/10356/94807 http://hdl.handle.net/10220/8147 10.1016/j.msea.2005.12.038 en Materials science and engineering A © 2006 Elsevier. This is the author created version of a work that has been peer reviewed and accepted for publication by Materials Science and Engineering A, Elsevier. It incorporates referee’s comments but changes resulting from the publishing process, such as copyediting, structural formatting, may not be reflected in this document. The published version is available at: [http://dx.doi.org/10.1016/j.msea.2005.12.038]." 16 p. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic DRNTU::Engineering::Materials
spellingShingle DRNTU::Engineering::Materials
Chen, Zhong
He, Min
Balakrisnan, Bavani
Chum, Chan Choy
Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films
description Intermetallic compounds (IMCs) are present in microelectronic solder interconnects as a result of interfacial reaction between the solder and the metallization materials. Their mechanical properties are of great interest for the prediction of joint reliability of electronic packages. In this work, thin film Ni3Sn4 IMCs were formed by co-sputtering of Sn and Ni, followed by annealing at different temperatures. Elasticity modulus and hardness of the films were investigated by nano-indentation. It was found that measured hardness decreased with increasing residual tensile stress in the film. The elasticity modulus of the Ni3Sn4 thin films was measured to be around 134 GPa by nano-indentation. The fracture toughness of these Ni3Sn4 thin films varied considerably with the annealing temperature. It ranged from 2.11 ± 0.15 MPa m1/2 for 100 °C annealing to 5.75 ± 0.25 MPa m1/2 for 200 °C annealing. Densification during annealing is believed to be the cause of the increase in toughness.
author2 School of Materials Science & Engineering
author_facet School of Materials Science & Engineering
Chen, Zhong
He, Min
Balakrisnan, Bavani
Chum, Chan Choy
format Article
author Chen, Zhong
He, Min
Balakrisnan, Bavani
Chum, Chan Choy
author_sort Chen, Zhong
title Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films
title_short Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films
title_full Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films
title_fullStr Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films
title_full_unstemmed Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films
title_sort elasticity modulus, hardness and fracture toughness of ni3sn4 intermetallic thin films
publishDate 2012
url https://hdl.handle.net/10356/94807
http://hdl.handle.net/10220/8147
_version_ 1772826390607953920