Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films

• Main Authors: Chen, Zhong, He, Min, Balakrisnan, Bavani, Chum, Chan Choy
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials
• Online Access: https://hdl.handle.net/10356/94807; http://hdl.handle.net/10220/8147
• Institution: Nanyang Technological University

Intermetallic compounds (IMCs) are present in microelectronic solder interconnects as a result of interfacial reaction between the solder and the metallization materials. Their mechanical properties are of great interest for the prediction of joint reliability of electronic packages. In this work, t...