Elasticity modulus, hardness and fracture toughness of Ni3Sn4 intermetallic thin films
Intermetallic compounds (IMCs) are present in microelectronic solder interconnects as a result of interfacial reaction between the solder and the metallization materials. Their mechanical properties are of great interest for the prediction of joint reliability of electronic packages. In this work, t...
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/94807 http://hdl.handle.net/10220/8147 |
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| Institution: | Nanyang Technological University |
| Language: | English |