Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

Self-assembled monolayer (SAM) of alkane-thiol is formed on copper (Cu) thin layer coated on silicon (Si) wafer with the aim to protect the surface against excessive oxidation during storage in the room ambient. After 3 days of storage, the temporary SAM layer is desorbed with in situ anneal in iner...

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Main Authors: Ang, X. F., Wei, J., Leong, K. C., Tan, Chuan Seng, Lim, Dau Fatt
Other Authors: A*STAR SIMTech
Format: Article
Language:English
Published: 2013
Subjects:
DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Online Access:https://hdl.handle.net/10356/96042
http://hdl.handle.net/10220/11241
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-960422020-03-07T12:47:12Z Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement Ang, X. F. Wei, J. Leong, K. C. Tan, Chuan Seng Lim, Dau Fatt A*STAR SIMTech DRNTU::Engineering::Electrical and electronic engineering::Microelectronics Self-assembled monolayer (SAM) of alkane-thiol is formed on copper (Cu) thin layer coated on silicon (Si) wafer with the aim to protect the surface against excessive oxidation during storage in the room ambient. After 3 days of storage, the temporary SAM layer is desorbed with in situ anneal in inert ambient to uncover the clean Cu surface. A pair of wafers is bonded at 250 °C. Clear evidences of in-plane and out-of-plane Cu grain growth are observed resulting in a wiggling bonding interface. This gives rise to enhancement in shear strength in the bonded Cusingle bondCu layer. 2013-07-11T08:48:29Z 2019-12-06T19:24:49Z 2013-07-11T08:48:29Z 2019-12-06T19:24:49Z 2011 2011 Journal Article https://hdl.handle.net/10356/96042 http://hdl.handle.net/10220/11241 10.1016/j.microrel.2011.04.003 en Microelectronics reliability © 2011 Elsevier Ltd.
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
spellingShingle DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Ang, X. F.
Wei, J.
Leong, K. C.
Tan, Chuan Seng
Lim, Dau Fatt
Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
description Self-assembled monolayer (SAM) of alkane-thiol is formed on copper (Cu) thin layer coated on silicon (Si) wafer with the aim to protect the surface against excessive oxidation during storage in the room ambient. After 3 days of storage, the temporary SAM layer is desorbed with in situ anneal in inert ambient to uncover the clean Cu surface. A pair of wafers is bonded at 250 °C. Clear evidences of in-plane and out-of-plane Cu grain growth are observed resulting in a wiggling bonding interface. This gives rise to enhancement in shear strength in the bonded Cusingle bondCu layer.
author2 A*STAR SIMTech
author_facet A*STAR SIMTech
Ang, X. F.
Wei, J.
Leong, K. C.
Tan, Chuan Seng
Lim, Dau Fatt
format Article
author Ang, X. F.
Wei, J.
Leong, K. C.
Tan, Chuan Seng
Lim, Dau Fatt
author_sort Ang, X. F.
title Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
title_short Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
title_full Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
title_fullStr Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
title_full_unstemmed Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
title_sort low temperature cu-cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
publishDate 2013
url https://hdl.handle.net/10356/96042
http://hdl.handle.net/10220/11241
_version_ 1681049957891571712

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