Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows

• المؤلفون الرئيسيون: Mona, M., Chen, Zhong, Kumar, Aditya
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/97078; http://hdl.handle.net/10220/10457

Electroless Ni-P layers with three different P contents (6.1 wt.%, 8.8 wt.%, and 12.3wt.%) were deposited on copper (Cu) substrates. Multilayered samples of Sn-3.5Ag/Ni-P/Cu stack were prepared and subjected to multiple reflows at 250°C. A tensile test was performed to investigate the effect of P co...