Comparison of electromigration simulation in test structure and actual circuit

• Main Authors: He, Feifei, Tan, Cher Ming
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Electrical and electronic engineering
• Online Access: https://hdl.handle.net/10356/98921; http://hdl.handle.net/10220/12570
• Institution: Nanyang Technological University

With the rapid increase in circuit complexity, accurate reliability simulator is necessary as reliability testing for fabricated circuit is progressively more time and resource consuming. Simple 2D electromigration (EM) simulator has many limitations and most of the 3D EM simulations in the literatu...