Oxidation behaviour of Cu thin films on Si wafer at 175-400°C

10.1016/S0167-577X(01)00268-3

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Bibliographic Details
Main Authors:	Gao, W., Gong, H., He, J., Thomas, A., Chan, L., Li, S.
Other Authors:	MATERIALS SCIENCE
Format:	Article
Published:	2014
Subjects:	Atomic force microscopy (AFM) Copper Diffusion Oxidation Thin films
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/107159
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Institution:	National University of Singapore

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