Cure of underfills in flip chips using microwave

2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics

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Bibliographic Details
Main Authors: Yi, S., Liu, L., Park, S.K.
Other Authors: TEMASEK LABORATORIES
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/111552
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Institution: National University of Singapore
Description
Summary:2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics