Cure of underfills in flip chips using microwave
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
Saved in:
| Main Authors: | , , |
|---|---|
| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/111552 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| id |
sg-nus-scholar.10635-111552 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-1115522024-11-14T08:54:09Z Cure of underfills in flip chips using microwave Yi, S. Liu, L. Park, S.K. TEMASEK LABORATORIES 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics 92-98 2014-11-28T01:53:30Z 2014-11-28T01:53:30Z 2004 Conference Paper Yi, S.,Liu, L.,Park, S.K. (2004). Cure of underfills in flip chips using microwave. 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 92-98. ScholarBank@NUS Repository. 0780387449 http://scholarbank.nus.edu.sg/handle/10635/111552 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics |
| author2 |
TEMASEK LABORATORIES |
| author_facet |
TEMASEK LABORATORIES Yi, S. Liu, L. Park, S.K. |
| format |
Conference or Workshop Item |
| author |
Yi, S. Liu, L. Park, S.K. |
| spellingShingle |
Yi, S. Liu, L. Park, S.K. Cure of underfills in flip chips using microwave |
| author_sort |
Yi, S. |
| title |
Cure of underfills in flip chips using microwave |
| title_short |
Cure of underfills in flip chips using microwave |
| title_full |
Cure of underfills in flip chips using microwave |
| title_fullStr |
Cure of underfills in flip chips using microwave |
| title_full_unstemmed |
Cure of underfills in flip chips using microwave |
| title_sort |
cure of underfills in flip chips using microwave |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/111552 |
| _version_ |
1821232132583849984 |