A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging

Microelectronics Reliability

Saved in:

Bibliographic Details
Main Authors:	Marks, M.R., Wei, Q., Jiaji, W., Yi, C.
Other Authors:	INSTITUTE OF MICROELECTRONICS
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/112959
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-112959
record_format	dspace
spelling	sg-nus-scholar.10635-1129592024-11-09T19:48:13Z A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging Marks, M.R. Wei, Q. Jiaji, W. Yi, C. INSTITUTE OF MICROELECTRONICS Microelectronics Reliability 35 5 807-815 MCRLA 2014-11-28T08:12:42Z 2014-11-28T08:12:42Z 1995-05 Article Marks, M.R.,Wei, Q.,Jiaji, W.,Yi, C. (1995-05). A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging. Microelectronics Reliability 35 (5) : 807-815. ScholarBank@NUS Repository. 00262714 http://scholarbank.nus.edu.sg/handle/10635/112959 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Microelectronics Reliability
author2	INSTITUTE OF MICROELECTRONICS
author_facet	INSTITUTE OF MICROELECTRONICS Marks, M.R. Wei, Q. Jiaji, W. Yi, C.
format	Article
author	Marks, M.R. Wei, Q. Jiaji, W. Yi, C.
spellingShingle	Marks, M.R. Wei, Q. Jiaji, W. Yi, C. A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging
author_sort	Marks, M.R.
title	A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging
title_short	A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging
title_full	A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging
title_fullStr	A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging
title_full_unstemmed	A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging
title_sort	high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/112959
_version_	1821214677192933376

A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging

Similar Items