A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging
Microelectronics Reliability
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Main Authors: | Marks, M.R., Wei, Q., Jiaji, W., Yi, C. |
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Other Authors: | INSTITUTE OF MICROELECTRONICS |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/112959 |
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Institution: | National University of Singapore |
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