Die attach failures related to wafer back metal processing - An AES study
Microelectronics Reliability
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sg-nus-scholar.10635-1129642015-01-14T18:35:19Z Die attach failures related to wafer back metal processing - An AES study Radhakrishnan, M.K. INSTITUTE OF MICROELECTRONICS Microelectronics Reliability 37 3 519-523 MCRLA 2014-11-28T08:12:46Z 2014-11-28T08:12:46Z 1997-03 Article Radhakrishnan, M.K. (1997-03). Die attach failures related to wafer back metal processing - An AES study. Microelectronics Reliability 37 (3) : 519-523. ScholarBank@NUS Repository. 00262714 http://scholarbank.nus.edu.sg/handle/10635/112964 NOT_IN_WOS Scopus |
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Microelectronics Reliability |
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INSTITUTE OF MICROELECTRONICS |
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INSTITUTE OF MICROELECTRONICS Radhakrishnan, M.K. |
| format |
Article |
| author |
Radhakrishnan, M.K. |
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Radhakrishnan, M.K. Die attach failures related to wafer back metal processing - An AES study |
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Radhakrishnan, M.K. |
| title |
Die attach failures related to wafer back metal processing - An AES study |
| title_short |
Die attach failures related to wafer back metal processing - An AES study |
| title_full |
Die attach failures related to wafer back metal processing - An AES study |
| title_fullStr |
Die attach failures related to wafer back metal processing - An AES study |
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Die attach failures related to wafer back metal processing - An AES study |
| title_sort |
die attach failures related to wafer back metal processing - an aes study |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/112964 |
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