Fracture analysis of silicon die and ceramic package using fractography
International Journal of Microcircuits and Electronic Packaging
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| Format: | Article |
| Published: |
2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/112968 |
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| Institution: | National University of Singapore |
| Summary: | International Journal of Microcircuits and Electronic Packaging |
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