Fracture analysis of silicon die and ceramic package using fractography

Fracture analysis of silicon die and ceramic package using fractography

International Journal of Microcircuits and Electronic Packaging

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Bibliographic Details
Main Author: Marks, Michael Raj
Other Authors: INSTITUTE OF MICROELECTRONICS
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/112968
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Institution: National University of Singapore
id sg-nus-scholar.10635-112968
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spelling sg-nus-scholar.10635-1129682015-01-14T18:06:20Z Fracture analysis of silicon die and ceramic package using fractography Marks, Michael Raj INSTITUTE OF MICROELECTRONICS International Journal of Microcircuits and Electronic Packaging 16 4 350-362 IMICD 2014-11-28T08:12:49Z 2014-11-28T08:12:49Z 1993-12 Article Marks, Michael Raj (1993-12). Fracture analysis of silicon die and ceramic package using fractography. International Journal of Microcircuits and Electronic Packaging 16 (4) : 350-362. ScholarBank@NUS Repository. 10631674 http://scholarbank.nus.edu.sg/handle/10635/112968 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description International Journal of Microcircuits and Electronic Packaging
author2 INSTITUTE OF MICROELECTRONICS
author_facet INSTITUTE OF MICROELECTRONICS
Marks, Michael Raj
format Article
author Marks, Michael Raj
spellingShingle Marks, Michael Raj
Fracture analysis of silicon die and ceramic package using fractography
author_sort Marks, Michael Raj
title Fracture analysis of silicon die and ceramic package using fractography
title_short Fracture analysis of silicon die and ceramic package using fractography
title_full Fracture analysis of silicon die and ceramic package using fractography
title_fullStr Fracture analysis of silicon die and ceramic package using fractography
title_full_unstemmed Fracture analysis of silicon die and ceramic package using fractography
title_sort fracture analysis of silicon die and ceramic package using fractography
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/112968
_version_ 1681094579597606912

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