Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging

10.1109/TEPM.2005.857676

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Bibliographic Details
Main Authors:	Liu, L., Yi, S., Ong, L.S., Chian, K.S., Osiyemi, S., Lim, S.H., Su, F.
Other Authors:	TEMASEK LABORATORIES
Format:	Article
Published:	2014
Subjects:	Electromagnetic heating Finite-element methods Flip-chip devices Modeling Packaging
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/115640
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-115640
record_format	dspace
spelling	sg-nus-scholar.10635-1156402023-10-27T07:58:37Z Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging Liu, L. Yi, S. Ong, L.S. Chian, K.S. Osiyemi, S. Lim, S.H. Su, F. TEMASEK LABORATORIES Electromagnetic heating Finite-element methods Flip-chip devices Modeling Packaging 10.1109/TEPM.2005.857676 IEEE Transactions on Electronics Packaging Manufacturing 28 4 355-363 ITEPF 2014-12-12T07:30:39Z 2014-12-12T07:30:39Z 2005-10 Article Liu, L., Yi, S., Ong, L.S., Chian, K.S., Osiyemi, S., Lim, S.H., Su, F. (2005-10). Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging. IEEE Transactions on Electronics Packaging Manufacturing 28 (4) : 355-363. ScholarBank@NUS Repository. https://doi.org/10.1109/TEPM.2005.857676 1521334X http://scholarbank.nus.edu.sg/handle/10635/115640 000232942900010 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Electromagnetic heating Finite-element methods Flip-chip devices Modeling Packaging
spellingShingle	Electromagnetic heating Finite-element methods Flip-chip devices Modeling Packaging Liu, L. Yi, S. Ong, L.S. Chian, K.S. Osiyemi, S. Lim, S.H. Su, F. Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
description	10.1109/TEPM.2005.857676
author2	TEMASEK LABORATORIES
author_facet	TEMASEK LABORATORIES Liu, L. Yi, S. Ong, L.S. Chian, K.S. Osiyemi, S. Lim, S.H. Su, F.
format	Article
author	Liu, L. Yi, S. Ong, L.S. Chian, K.S. Osiyemi, S. Lim, S.H. Su, F.
author_sort	Liu, L.
title	Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
title_short	Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
title_full	Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
title_fullStr	Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
title_full_unstemmed	Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
title_sort	chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/115640
_version_	1781789414579503104

Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging

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