Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging

Chemothermal modeling and finite-element analysis for microwave cure process of underfill in flip-chip packaging

10.1109/TEPM.2005.857676

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Bibliographic Details
Main Authors: Liu, L., Yi, S., Ong, L.S., Chian, K.S., Osiyemi, S., Lim, S.H., Su, F.
Other Authors: TEMASEK LABORATORIES
Format: Article
Published: 2014
Subjects:
Electromagnetic heating
Finite-element methods
Flip-chip devices
Modeling
Packaging
Online Access:http://scholarbank.nus.edu.sg/handle/10635/115640
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Institution: National University of Singapore
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