Finite-ground thin-film microstrip interconnects (TFMIs) and their power handling capabilities over ultra-wide frequency ranges
10.1109/APMC.2005.1606428
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Main Authors: | Yin, W.-Y., Dong, X.T., Mao, J. |
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Other Authors: | TEMASEK LABORATORIES |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/116080 |
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Institution: | National University of Singapore |
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