Frequency-dependent low cycle fatigue of Sn1Ag0.1Cu(In/Ni) solder joints subjected to high-frequency loading

Frequency-dependent low cycle fatigue of Sn1Ag0.1Cu(In/Ni) solder joints subjected to high-frequency loading

10.1007/s11664-013-2889-0

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Bibliographic Details
Main Authors: Wong, E.H., Seah, S.K.W., Shim, V.P.W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2016
Subjects:
Drop-impact
frequency-dependent
high strain
lead-free solder
low cycle fatigue
Online Access:http://scholarbank.nus.edu.sg/handle/10635/125116
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Institution: National University of Singapore
Description
Summary:10.1007/s11664-013-2889-0

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