Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging
10.1002/9780470950012.ch11
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2016
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sg-nus-scholar.10635-1251232016-06-05T09:16:05Z Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging Tan, V.B.C. Ong, K.C. Lim, C.T. Field, J.E. MECHANICAL ENGINEERING "small" and "green"-motivations for research into dynamic mechanical properties Dynamic material properties-of solder specimens Dynamic mechanical properties and microstructural studies-lead-free solders in electronic packaging Specimen preparation-revealing bulk solder and solder ball microstructure Young's modulus of solder specimens 10.1002/9780470950012.ch11 Structural Dynamics of Electronic and Photonic Systems 255-276 2016-06-03T08:08:16Z 2016-06-03T08:08:16Z 2011-04-07 Others Tan, V.B.C.,Ong, K.C.,Lim, C.T.,Field, J.E. (2011-04-07). Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging. Structural Dynamics of Electronic and Photonic Systems : 255-276. ScholarBank@NUS Repository. <a href="https://doi.org/10.1002/9780470950012.ch11" target="_blank">https://doi.org/10.1002/9780470950012.ch11</a> 9780470250020 http://scholarbank.nus.edu.sg/handle/10635/125123 NOT_IN_WOS Scopus |
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| topic |
"small" and "green"-motivations for research into dynamic mechanical properties Dynamic material properties-of solder specimens Dynamic mechanical properties and microstructural studies-lead-free solders in electronic packaging Specimen preparation-revealing bulk solder and solder ball microstructure Young's modulus of solder specimens |
| spellingShingle |
"small" and "green"-motivations for research into dynamic mechanical properties Dynamic material properties-of solder specimens Dynamic mechanical properties and microstructural studies-lead-free solders in electronic packaging Specimen preparation-revealing bulk solder and solder ball microstructure Young's modulus of solder specimens Tan, V.B.C. Ong, K.C. Lim, C.T. Field, J.E. Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging |
| description |
10.1002/9780470950012.ch11 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tan, V.B.C. Ong, K.C. Lim, C.T. Field, J.E. |
| format |
Others |
| author |
Tan, V.B.C. Ong, K.C. Lim, C.T. Field, J.E. |
| author_sort |
Tan, V.B.C. |
| title |
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging |
| title_short |
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging |
| title_full |
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging |
| title_fullStr |
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging |
| title_full_unstemmed |
Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging |
| title_sort |
dynamic mechanical properties and microstructural studies of lead-free solders in electronic packaging |
| publishDate |
2016 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/125123 |
| _version_ |
1681096162308784128 |