Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging
10.1002/9780470950012.ch11
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Main Authors: | Tan, V.B.C., Ong, K.C., Lim, C.T., Field, J.E. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Others |
Published: |
2016
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/125123 |
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Institution: | National University of Singapore |
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