Dynamic Mechanical Properties and Microstructural Studies of Lead-Free Solders in Electronic Packaging

• Main Authors: Tan, V.B.C., Ong, K.C., Lim, C.T., Field, J.E.
• Other Authors: MECHANICAL ENGINEERING
• Format: Others
• Published: 2016
• Subjects: "small" and "green"-motivations for research into dynamic mechanical properties; Dynamic material properties-of solder specimens; Dynamic mechanical properties and microstructural studies-lead-free solders in electronic packaging; Specimen preparation-revealing bulk solder and solder ball microstructure; Young's modulus of solder specimens
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/125123
• Institution: National University of Singapore

10.1002/9780470950012.ch11