The impact of surface damage region and edge recombination on the effective lifetime of silicon wafers at low illumination conditions

The impact of surface damage region and edge recombination on the effective lifetime of silicon wafers at low illumination conditions

10.1063/1.4913451

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Bibliographic Details
Main Authors: Hameiri Z., Ma, F.-J.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: American Institute of Physics Inc. 2016
Online Access:http://scholarbank.nus.edu.sg/handle/10635/128145
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Institution: National University of Singapore
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Summary:10.1063/1.4913451

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