A study of the Si3N4/Cu/Ta thin film systems for dual damascene technology
Master's
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2010
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/13762 |
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sg-nus-scholar.10635-137622015-01-12T11:08:54Z A study of the Si3N4/Cu/Ta thin film systems for dual damascene technology YONG LAI LIN, CLARE CHEMICAL & BIOMOLECULAR ENGINEERING ZENG HUA CHUN Copper, silicon nitride, alpa/beta-tantalum, ammonia plasma treatment, electromigration, adhesion. Master's MASTER OF ENGINEERING 2010-04-08T10:36:13Z 2010-04-08T10:36:13Z 2004-02-09 Thesis YONG LAI LIN, CLARE (2004-02-09). A study of the Si3N4/Cu/Ta thin film systems for dual damascene technology. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/13762 NOT_IN_WOS en |
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National University of Singapore |
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NUS Library |
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Singapore |
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ScholarBank@NUS |
language |
English |
topic |
Copper, silicon nitride, alpa/beta-tantalum, ammonia plasma treatment, electromigration, adhesion. |
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Copper, silicon nitride, alpa/beta-tantalum, ammonia plasma treatment, electromigration, adhesion. YONG LAI LIN, CLARE A study of the Si3N4/Cu/Ta thin film systems for dual damascene technology |
description |
Master's |
author2 |
CHEMICAL & BIOMOLECULAR ENGINEERING |
author_facet |
CHEMICAL & BIOMOLECULAR ENGINEERING YONG LAI LIN, CLARE |
format |
Theses and Dissertations |
author |
YONG LAI LIN, CLARE |
author_sort |
YONG LAI LIN, CLARE |
title |
A study of the Si3N4/Cu/Ta thin film systems for dual damascene technology |
title_short |
A study of the Si3N4/Cu/Ta thin film systems for dual damascene technology |
title_full |
A study of the Si3N4/Cu/Ta thin film systems for dual damascene technology |
title_fullStr |
A study of the Si3N4/Cu/Ta thin film systems for dual damascene technology |
title_full_unstemmed |
A study of the Si3N4/Cu/Ta thin film systems for dual damascene technology |
title_sort |
study of the si3n4/cu/ta thin film systems for dual damascene technology |
publishDate |
2010 |
url |
http://scholarbank.nus.edu.sg/handle/10635/13762 |
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1681078913064763392 |