Modeling and characterization of abrasive-free copper chemical mechanical planarization process

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Main Author:	TABASSUMUL HAQUE
Other Authors:	MECHANICAL ENGINEERING
Format:	Theses and Dissertations
Language:	English
Published:	2010
Subjects:	Abrasive-free Copper CMP, Material Removal Mechanism, Material Removal Rate, Within Wafer Non-Uniformity, Non-Prestonian Phenomenon, Modes of Contact
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/14454
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Institution:	National University of Singapore
Language:	English

id	sg-nus-scholar.10635-14454
record_format	dspace
spelling	sg-nus-scholar.10635-144542015-01-07T08:45:49Z Modeling and characterization of abrasive-free copper chemical mechanical planarization process TABASSUMUL HAQUE MECHANICAL ENGINEERING SENTHIL KUMAR, A Abrasive-free Copper CMP, Material Removal Mechanism, Material Removal Rate, Within Wafer Non-Uniformity, Non-Prestonian Phenomenon, Modes of Contact Master's MASTER OF ENGINEERING 2010-04-08T10:43:21Z 2010-04-08T10:43:21Z 2005-02-14 Thesis TABASSUMUL HAQUE (2005-02-14). Modeling and characterization of abrasive-free copper chemical mechanical planarization process. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/14454 NOT_IN_WOS en
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
language	English
topic	Abrasive-free Copper CMP, Material Removal Mechanism, Material Removal Rate, Within Wafer Non-Uniformity, Non-Prestonian Phenomenon, Modes of Contact
spellingShingle	Abrasive-free Copper CMP, Material Removal Mechanism, Material Removal Rate, Within Wafer Non-Uniformity, Non-Prestonian Phenomenon, Modes of Contact TABASSUMUL HAQUE Modeling and characterization of abrasive-free copper chemical mechanical planarization process
description	Master's
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING TABASSUMUL HAQUE
format	Theses and Dissertations
author	TABASSUMUL HAQUE
author_sort	TABASSUMUL HAQUE
title	Modeling and characterization of abrasive-free copper chemical mechanical planarization process
title_short	Modeling and characterization of abrasive-free copper chemical mechanical planarization process
title_full	Modeling and characterization of abrasive-free copper chemical mechanical planarization process
title_fullStr	Modeling and characterization of abrasive-free copper chemical mechanical planarization process
title_full_unstemmed	Modeling and characterization of abrasive-free copper chemical mechanical planarization process
title_sort	modeling and characterization of abrasive-free copper chemical mechanical planarization process
publishDate	2010
url	http://scholarbank.nus.edu.sg/handle/10635/14454
_version_	1681079029734572032

Modeling and characterization of abrasive-free copper chemical mechanical planarization process

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